Wafer Laser Cutting Machine
Laser power:
5W-30W
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Wafer Laser Cutting Machine
Retail price
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Market price
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Number of views:
1000
Product serial number
Category
Laser precision machining
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Product description
Specifications
Sample display
Laser power:
5W-30W
Features:
» Fast dicing speed, high efficiency, high chip yield
» Non-contact processing, no mechanical stress, high chip quality
» CCD fast positioning function, real-time coaxial monitoring or side axis monitoring function
» High-precision two-dimensional linear motion platform, High-precision DD rotary platform
» Marble abutment, stable and reliable, small thermal deformation
» Scribing process expert system
» High reliability and stability
» Equipped with automatic splitting equipment, easy to operate and high efficiency
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Wafer Laser Back Cutting Machine
Contact us
Company address
No. 66, Tonghe Road, Weiting Town, Suzhou Industrial Park
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Website
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